皮秒激光器系列

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皮秒激光器

Picosecond Micromachining Laser




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Key FeaturesApplications
• Industrial rugged unibody design

• Easy integration

• Horizontal or vertical mounting

• Fully detachable umbilical

• Cost-effective, on-site maintenance

• High productivity:

- Wide range of PRF

- A/D modulation capability

- FlexBurstTM technology

• High speed precision micromachining

• Glass cutting, welding, scribing

• Processing hard materials (diamond, sapphire,carbide,

ceramics, and CVD)

• Semiconductor dicing

• Drilling of multiple materials

• Selective thin-film ablation




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